PANDUIT GB2B0312TPI-1 Panduit GB2B0312TPI-1 Telecom Grounding Busbar

Applications

Telecom/Data Center

Features

• Meets BICSI and J-STD-607-A requirements for network systems grounding applications
• Made of high conductivity copper and tin-plated to inhibit corrosion
• Comes pre-assembled with brackets and insulators attached for quick installation
• Use Panduit self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below

Specification Description

Telecommunications Grounding Busbar
Number Of 1/4 Inch Stud Hole Sets, 5/8 Inch Hole Spacing: 12
Number Of 3/8 Inch Stud Hole Sets, 1 Inch Hole Spacing: 3
Number Of 5/16 Inch Hole Sets, 5/8 Inch Spacing: 12
Number Of 7/16 Inch Hole Sets, 1 Inch Spacing: 3
Dimension: 20 Inch Length x 2 Inch Width x 1/4 Inch Height (508 mm x 51 mm x 6.4 mm)

Tech Info

BICSI/TIA-607-C, cULus