Model:
RGCBNJ660PY, 306470
SKU:
RGCBNJ660PY, 306470
Availability:
In Stock
documents:
Spec Sheet
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Applications

Telecom/Data Center

Features

  • Bonds the rack or cabinet to the MCBN
  • HTAPs, included in kits, require crimping tool and die
  • HTAP is UL Listed and CSA Certified for applications up to 600 V when crimped with Panduit and specified competitor crimping tools and Panduit crimping dies
  • Engineered to comply with US and International grounding requirements

Tech Info

UL/CSA, Rohs Compliant

Technical

Component
GROUNDING KITS
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